Difference between revisions of "Talk:Equipment/Electronics Workbenches/T-962A Reflow Oven"
From Makespace
| Line 4: | Line 4: | ||
42% | 42% | ||
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| + | 0.1mm over scan | ||
rotate stencil 45° - cutting at 0° or 90° blows out the webs between pads. | rotate stencil 45° - cutting at 0° or 90° blows out the webs between pads. | ||
| Line 20: | Line 22: | ||
--[[User:Pinski1|Pinski1]] ([[User talk:Pinski1|talk]]) 18:37, 5 August 2015 (BST) | --[[User:Pinski1|Pinski1]] ([[User talk:Pinski1|talk]]) 18:37, 5 August 2015 (BST) | ||
| + | |||
| + | CUSF's myarl stencils are cut with: | ||
| + | |||
| + | 500mm/s | ||
| + | |||
| + | 50% | ||
| + | |||
| + | 0.05mm over scan | ||
| + | |||
| + | and rotate stencil 45° | ||
| + | |||
| + | --[[User:Pinski1|Pinski1]] ([[User talk:Pinski1|talk]]) 23:41, 5 August 2015 (BST) | ||
Revision as of 22:41, 5 August 2015
Okay ish setting s for 125micron mylar:
400mm/s
42%
0.1mm over scan
rotate stencil 45° - cutting at 0° or 90° blows out the webs between pads.
Try reducing the cut, still some webs blew through.
ToDo seperate page for stencils/SMD HowTo
--Pinski1 (talk) 22:40, 4 August 2015 (BST)
Using a ULP in eagle to export top and botom cream layers as poly-lines in a DXF.
script: https://github.com/SWITCHSCIENCE/ssci-eagle-public/blob/master/cream-dxf.ulp
--Pinski1 (talk) 18:37, 5 August 2015 (BST)
CUSF's myarl stencils are cut with:
500mm/s
50%
0.05mm over scan
and rotate stencil 45°
