Difference between revisions of "Talk:Equipment/Electronics Workbenches/T-962A Reflow Oven"
From Makespace
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--[[User:Pinski1|Pinski1]] ([[User talk:Pinski1|talk]]) 23:41, 5 August 2015 (BST) | --[[User:Pinski1|Pinski1]] ([[User talk:Pinski1|talk]]) 23:41, 5 August 2015 (BST) | ||
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| + | The parts list for the add on/upgrade PCB is: https://dl.dropboxusercontent.com/u/3638084/ThermocoupleParts-Sorted.xls | ||
Latest revision as of 20:12, 9 February 2017
Okay ish setting s for 125micron mylar:
400mm/s
42%
0.1mm over scan
rotate stencil 45° - cutting at 0° or 90° blows out the webs between pads.
Try reducing the cut, still some webs blew through.
ToDo seperate page for stencils/SMD HowTo
--Pinski1 (talk) 22:40, 4 August 2015 (BST)
Using a ULP in eagle to export top and botom cream layers as poly-lines in a DXF.
script: https://github.com/SWITCHSCIENCE/ssci-eagle-public/blob/master/cream-dxf.ulp
--Pinski1 (talk) 18:37, 5 August 2015 (BST)
CUSF's myarl stencils are cut with:
500mm/s
50%
0.05mm over scan
and rotate stencil 45°
--Pinski1 (talk) 23:41, 5 August 2015 (BST)
The parts list for the add on/upgrade PCB is: https://dl.dropboxusercontent.com/u/3638084/ThermocoupleParts-Sorted.xls
